FSFC120 Auto Molding System

Publishdate:2024-09-12  Source:  Views:189

 

Product Introduction:

Mainly used for post-process packaging of IC, semiconductor device and substrates type. In addition to meeting the product packaging form applicable to FSAM equipment, it is especially suitable for flip-chip packaging and multi-pin, high-pin and other products.

This system includes loading unit, lead frame alignment unit, lead frame traction unit, lead frame preheating unit, resin supply unit, mechanical arm of loading and unloading unit, press unit, degating unit and product storage unit.

 

Product Features:

◆ Max applicable L/F size: W78mm*L260 mm

◆ Adopts gantry transfer loading unit to prevent LF shaking and warping during transfer.

◆ Suitable for flip-chip type molding and multi-leads, high lead type molding.

 

Technical parameter

Parameters of FSFC120 Auto Molding System
Name Parameters
L/F size Width 78mm
Length 260mm
Thickness 0.1mm~2.0mm
L/F Quantity/Shot 2 pieces per mold
Resin size Resin diameter 11mm--20mm
Resin length-diameter ratio 1.1~1.7(Max35mm)
Size of loading magazine placement area 325mm
System mechanical time ≥28s
Maximum clamping pressure (per unit) 120T
Maximum transfer pressure (per unit) 3T
Transfer stroke ≥85mm
Transfer speed 0.1--20mm/sec
8stage speed regulation
Mold opening and closing speed High speed140mm/sec
low speed0.1--10mm/sec

 

Product Introduction:

Mainly used for post-process packaging of IC, semiconductor device and substrates type. In addition to meeting the product packaging form applicable to FSAM equipment, it is especially suitable for flip-chip packaging and multi-pin, high-pin and other products.

This system includes loading unit, lead frame alignment unit, lead frame traction unit, lead frame preheating unit, resin supply unit, mechanical arm of loading and unloading unit, press unit, degating unit and product storage unit.

 

Product Features:

◆ Max applicable L/F size: W78mm*L260 mm

◆ Adopts gantry transfer loading unit to prevent LF shaking and warping during transfer.

◆ Suitable for flip-chip type molding and multi-leads, high lead type molding.

 

Technical parameter

Parameters of FSFC120 Auto Molding System
Name Parameters
L/F size Width 78mm
Length 260mm
Thickness 0.1mm~2.0mm
L/F Quantity/Shot 2 pieces per mold
Resin size Resin diameter 11mm--20mm
Resin length-diameter ratio 1.1~1.7(Max35mm)
Size of loading magazine placement area 325mm
System mechanical time ≥28s
Maximum clamping pressure (per unit) 120T
Maximum transfer pressure (per unit) 3T
Transfer stroke ≥85mm
Transfer speed 0.1--20mm/sec
8stage speed regulation
Mold opening and closing speed High speed140mm/sec
low speed0.1--10mm/sec