FSAM180 Auto Molding System

Publishdate：2024-09-12 Source： Views：93

Product Introduction:

Mainly used for post-process packaging of IC, semiconductor device and substrates type. The main applicable product packaging forms are: SOP, SOT, SOD, SMA, SMB, SMC, DFN, QFN, QFP, BGA, CSP, PLCC, MCM, IGBT, IPM, LED substrate, etc.

This system includes loading unit, lead frame alignment unit, lead frame traction unit, lead frame preheating unit, resin supply unit, mechanical arm of loading and unloading unit, press unit, degating unit and product storage unit.

Product Features:

◆ Max applicable L/F size: W100mm*L300 mm

◆ The new design of press unit and automatic loading and unloading units can meet high quality requirements in a wide range of fields.

◆ Suitable for packaging products like SOP, LQFP, BGA, QFN and etc.

Technical parameter

Parameters of FSAM180 Auto Molding System
Name		Parameters
L/F size	Width	100mm
	Length	300mm
	Thickness	0.1mm~2.0mm
	L/F Quantity/Shot	2 pieces per mold
Resin size	Resin diameter	11mm--20mm
	Resin length-diameter ratio	1.1~1.7（Max35mm)
Size of loading magazine placement area		325mm
System mechanical time		≥28s
Maximum clamping pressure (per unit)		180T
Maximum transfer pressure (per unit)		4T
Transfer stroke		≥85mm
Transfer speed		0.1--20mm/sec
		8stage speed regulation
Mold opening and closing speed		High speed140mm/sec
		low speed0.1--10mm/sec