FSDM180 Dual Transfer Auto Molding System

Publishdate:2024-09-12  Source:  Views:195

Product Introduction:

Mainly used for the packaging of narrow products such as power devices and tantalum capacitors. It meets the packaging form of lead frames within 55mm * 300mm. It improves product quality and achieves stable mass production of a single product.

The system adopts a modular design and has a fully automatic device that integrates the auto loading of lead frame and resin, loading unit, unloading unit, press unit, mold and product auto degating and collection. It changes the previous single row transfer unit packaging form, adopts double row transfer units for packaging, realizes that one press can package 4 L/F. It doubles production capacity while reducing power consumption, labor demand, and site demand by half. This system is suitable for power devices, tantalum capacitors and other products.

 

Product Features:

◆Max applicable L/F size: W55*L300 mm;

◆By implementing a one-time 4-pieces packaging, power consumption, manpower requirements and site requirements are halved while doubling production capacity compared to FSAM equipment;

◆Suitable for narrow products such as power devices and tantalum capacitors, improving the packaging quality of such products;

◆Adopts gantry transfer loading unit to prevent LF shaking and warping during transfer.

 

Technical parameter

Parameters of FSFC180 Double Injection Auto Molding System
Name Parameters
L/F size Width 55mm
Length 300mm
Thickness 0.1mm~2.0mm
L/F Quantity/Shot 4 pieces per mold
Resin size Resin diameter 12mm--20mm
Resin length-diameter ratio 1.1~1.7(Max35mm)
Size of loading magazine placement area 550mm
System mechanical time ≥35s
Maximum clamping pressure (per unit) 180T
Maximum transfer pressure (per unit) 4T
Transfer stroke ≥85mm
Transfer speed 0.1--20mm/sec
8stage speed regulation
Mold opening and closing speed High speed140mm/sec
low speed0.1--10mm/sec

Product Introduction:

Mainly used for the packaging of narrow products such as power devices and tantalum capacitors. It meets the packaging form of lead frames within 55mm * 300mm. It improves product quality and achieves stable mass production of a single product.

The system adopts a modular design and has a fully automatic device that integrates the auto loading of lead frame and resin, loading unit, unloading unit, press unit, mold and product auto degating and collection. It changes the previous single row transfer unit packaging form, adopts double row transfer units for packaging, realizes that one press can package 4 L/F. It doubles production capacity while reducing power consumption, labor demand, and site demand by half. This system is suitable for power devices, tantalum capacitors and other products.

 

Product Features:

◆Max applicable L/F size: W55*L300 mm;

◆By implementing a one-time 4-pieces packaging, power consumption, manpower requirements and site requirements are halved while doubling production capacity compared to FSAM equipment;

◆Suitable for narrow products such as power devices and tantalum capacitors, improving the packaging quality of such products;

◆Adopts gantry transfer loading unit to prevent LF shaking and warping during transfer.

 

Technical parameter

Parameters of FSFC180 Double Injection Auto Molding System
Name Parameters
L/F size Width 55mm
Length 300mm
Thickness 0.1mm~2.0mm
L/F Quantity/Shot 4 pieces per mold
Resin size Resin diameter 12mm--20mm
Resin length-diameter ratio 1.1~1.7(Max35mm)
Size of loading magazine placement area 550mm
System mechanical time ≥35s
Maximum clamping pressure (per unit) 180T
Maximum transfer pressure (per unit) 4T
Transfer stroke ≥85mm
Transfer speed 0.1--20mm/sec
8stage speed regulation
Mold opening and closing speed High speed140mm/sec
low speed0.1--10mm/sec