Wafer Level Packaging Equipment

Publishdate：2024-09-12 Source： Views：107

Product Introduction:

Mainly used for advanced molding technology compression molding equipment for integrated circuits. It can realize two package forms of flange mold and full mold，suitable for package of liquid and granular resins, suitable for 8 inch, 12 inch, 320 diameter specification substrates.

This equipment includes press unit, filming unit, high vacuum unit and precision mold unit, as well as auto extrusion unit, powder spreading mechanism, and mold replacement special car.

Product Features:

◆Carrier: Maximum applicable 12 inches, 320 diameter

◆Adopting servo synchronous control technology, the consistency of the thickness of the package can be automatically adjusted

◆Suitable for compression molding package in wafer level WLP/panel level PLP and other forms。

Technical parameter

Wafer level packaging equipment
Name	Parameters
Wafer/carrier size	12 inch/φ320mm
Wafer/carrier thickness	0.4-1.5mm
Mold PKG thickness	0.25 -2.1 mm/±15um
Mold-to-mold TTV over kit lifetime	±15um
Molding Offset	≤0.2mm
Cavity vacuum	＜10Torr (within 2sec)
Molding chase temperature/accuracy	Max 190±3℃/±1℃
Clamp Force	80T/±1Ton
Closing Speed	Min. 0.01mm/s
	Max. 36mm/s
	10 steps