FSAM120 Auto Molding System

Publishdate：2024-09-12 Source： Views：124

Product Introduction:

Mainly used for post-process packaging of IC, semiconductor device and substrates type. The main applicable product packaging forms are: SOP, SOT, SOD, SMA, SMB, SMC, DFN, QFN, QFP, BGA, CSP, PLCC, MCM, IGBT, IPM, LED substrate, etc.

This system includes loading unit, lead frame alignment unit, lead frame traction unit, lead frame preheating unit, resin supply unit, mechanical arm of loading and unloading unit, press unit, degating unit and product storage unit.

Product Features:

◆ Max applicable L/F size: W78mm*L260 mm

◆ Over a decade of experience and track record since its launch in 2007 (34% national market share in 2022)

◆ Provides the most cost-effective solution for common type products

Technical parameter

Parameters of FSAM120 Auto Molding System
Name		Parameters
L/F size	Width	78mm
	Length	260mm
	Thickness	0.1mm~2.0mm
	L/F Quantity/Shot	2 pieces per mold
Resin size	Resin diameter	11mm--20mm
	Resin length-diameter ratio	1.1~1.7（Max35mm)
Size of loading magazine placement area		325mm
System mechanical time		≥28s
Maximum clamping pressure (per unit)		120T
Maximum transfer pressure (per unit)		3T
Transfer stroke		≥85mm
Transfer speed		0.1--20mm/sec
		8stage speed regulation
Mold opening and closing speed		High speed140mm/sec
		low speed0.1--10mm/sec