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Hydraulic Molding System
Publishdate：2024-09-13 Source： Views：141
Product Introduction:
It's used for molding process of IC and semiconductor devices. It adopts a servo system to drive mold closing and transfer to achieve fast speed and good stability. It can be configured with specifications such as 250 tons, 350 tons, 450 tons, etc.
Product Introduction:
It's used for molding process of IC and semiconductor devices. It adopts a servo system to drive mold closing and transfer to achieve fast speed and good stability. It can be configured with specifications such as 250 tons, 350 tons, 450 tons, etc.
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