MGP Mold

Publishdate：2024-09-13  Source：  Views：157

 

Product Introduction:

It's used for molding process of IC and semiconductor devices. It adopts multiple plungers structure and quick change structure. It can be configured with vacuum, retractable pin structure and other forms.

 

Product Introduction:

It's used for molding process of IC and semiconductor devices. It adopts multiple plungers structure and quick change structure. It can be configured with vacuum, retractable pin structure and other forms.

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