Optimizing mold design through 3D packaging mold flow simulation software

Publishdate：2024-09-03 Source： Views：97

Analysis Capacity

1, Provide a range of chip packaging simulation solutions;

2, The wire warping and gold wire sweeping after filling, hardening and curing are presented dynamically;

3, Analysis and comparison of molding results of different brands of epoxy resin in the same environment.

Analysis Capacity

1, Provide a range of chip packaging simulation solutions;

2, The wire warping and gold wire sweeping after filling, hardening and curing are presented dynamically;

3, Analysis and comparison of molding results of different brands of epoxy resin in the same environment.