This product series primarily provides customers with specialized equipment for semiconductor post-processing molding process and provides customers with high-quality molding equipment, molds and technical services through transfer molding and compression molding technology.

For IC and semiconductor device Trim&Form process, it adopts flexible punching technology, with punching pressure compensation function. The entire series is equipped with dual magazine mechanism, which can meet various packaging forms such as TO, DIP, SOT, SOP, QFP, QFN, Optocoupler, IPM, etc. The device can be equipped with intelligent CCD, remote operation and maintenance, CIM management system, QR code document scanning and other functions.

Precision packaging molds and supporting equipment for packaging processes of IC and semiconductor devices, relying on the company's ultra-precision machining and computer simulation capabilities, integrating the company's 30 years of experience in packaging mold design and development, can provide users with various customized product services.

Trinity has been manufacturing plastic profile extrusion tooling and equipment since 1985, and has successfully exported them to more than 600 users in more than 50 countries and regions. It is one of the most competitive extrusion tooling and equipment manufacturer in the world.

Trinity specializes in manufacturing various precision stamping and injection parts. Roller bearing housing and seal kits have been successfully exported to more than 50 countries in the world. It is the unit that drafts and compiles industry standards of roller bearing housing for belt conveyors. With its technical and quality advantages, products are widely used in Long distance belt conveyor engineering project applying for domestic and overseas markets.